国产成人一区在线播放|日韩精品无码人成视频|色婷婷五月综合亚洲小说|日本乱人伦中文字幕三区|亚洲AV高潮潮喷久久天堂|久久老色鬼天天综合网观看|日韩人妻无码精品久久久不卡|亚洲成Av人片乱码色午夜在线

0574-58121888
HomeProducts — SiP(System in Package)

SiP(System in Package)

MEMS (Micro Electro Mechanical Systems) Microphones

SiP(System in Package): From the traditional Single chip with passive components, developing to Multi chip multifunctional chip with passive components, including normal chip (Die bond/Wire bond) and Flip chip hybrid packaging technology
Product Overview

SiP(System in Package): From the traditional Single chip with passive components, developing to Multi chip multifunctional chip with passive components, including normal chip (Die bond/Wire bond) and Flip Chip hybrid packaging technology, as well as other devices such as MEMS or optical Sensor devices and other devices are prioritized to be assembled together, to achieve a certain function of the standard package and forming a system or sub-system. Package types are LGA, BGA and so on.

Product Application

IOT/Smart Home, IOT series (Bluetooth /Wifi, etc.), UAV/Intelligent Robot Control Module, Automotive Intelligent Driving Position/Autonomous Driving, Mobile Terminal 5G communication and other Applications.

Technical Features

1. 5G PAM/FEM/DiFEM/PAMiF/PAMiD etc
2. DS-SiP module technology
3. High precision 01005/008004 SMT Mounting Technology
4. Multi-chips mounting,GaAs FC/WLCSP/Crystal and other substrate interposer mounting
5. SiP EMI shielding technology
6. SiP module size 2×1.6 ~50~52mm

甘洛县| 临城县| 华阴市| 华容县| 长春市| 静安区| 绥化市| 集安市| 高雄市| 阳曲县| 白玉县| 鸡西市| 龙口市| 永城市| 玛曲县| 凤翔县| 加查县| 遂溪县| 新巴尔虎右旗| 布拖县| 红安县| 睢宁县| 湟源县| 延长县| 沈阳市| 巴青县| 临夏市| 卓尼县| 高碑店市| 安康市| 柳州市| 兴文县| 德惠市| 鄂温| 延川县| 正安县| 永定县| 浦县| 昌吉市| 北票市| 平遥县|