BGA(Ball Grid Array): Interconnection of chip and substrate is realized by using Die bond/Wire bond or advanced normal chip combine with Flip chip named Hybrid BGA technology. Meanwhile, array solder balls on the backside of the package substrate as the I/O terminals of the chip to be interconnected with the printed circuit board (PCB).

Advantages of BGA package technology is firstly the number of I/O pins increases while the pin pitch also increases, then improving the assembly yield. Secondly, Electrical performance of the BGA chip parasitic parameters are reduced, signal transmission delay is small, and the frequency of use is increased.

IOT/Smart Home, IOT Series (Bluetooth /Wifi etc.), AR, Baseband, Touch AP, Mobile Terminals and other Applications.

1. Max product size 22.5 x 25.3mm, over 1500 wires
2. Die to die copper wire is a benchmark
3. Fine pitch(BPP/BPO: 45/39um)
4. 12nm ELK wire bond is cooper wire on wafer
5. FC(6nm) + WB hybrid packaging technology