FCCSP/FCBGA (Flip-chip CSP/BGA): Advanced high-precision Flip chip level packages with Cu pillar or Solder bump by flipping the chip over and attaching it to the substrate. High heat dissipation solutions such as heat sinks are utilized to provide better electrical performance, better heat dissipation, and better solder joint reliability.

Baseband, Bluetooth, Wifi, AI, AP, GPU/CPU and other HPC, are widely used in Mobile Terminals, Smart TVs, Notebooks, Networks and Server.

1. FCCSP/FCBGA Solder/Cu pillar bump high-precision Flip-Chip technology
2. MSAP/ETS/Coreless/ABF substrate
3. Bottom filling method CUF/MUF
4. Wafer Tech. 28nm~5nm
5. Fine-pitch 78um