国产成人一区在线播放|日韩精品无码人成视频|色婷婷五月综合亚洲小说|日本乱人伦中文字幕三区|亚洲AV高潮潮喷久久天堂|久久老色鬼天天综合网观看|日韩人妻无码精品久久久不卡|亚洲成Av人片乱码色午夜在线

0574-58121888
HomeProducts — Flip-Chip

Flip-Chip

FCCSP/FCBGA (Flip-chip CSP/BGA): Advanced high-precision Flip chip level packages with Cu pillar or Solder bump by flipping the chip over and attaching it to the substrate
Product Overview

FCCSP/FCBGA (Flip-chip CSP/BGA): Advanced high-precision Flip chip level packages with Cu pillar or Solder bump by flipping the chip over and attaching it to the substrate. High heat dissipation solutions such as heat sinks are utilized to provide better electrical performance, better heat dissipation, and better solder joint reliability.

Product Application

Baseband, Bluetooth, Wifi, AI, AP, GPU/CPU and other HPC, are widely used in Mobile Terminals, Smart TVs, Notebooks, Networks and Server.

Technical Features

1. FCCSP/FCBGA Solder/Cu pillar bump high-precision Flip-Chip technology
2. MSAP/ETS/Coreless/ABF substrate
3. Bottom filling method CUF/MUF
4. Wafer Tech. 28nm~5nm
5. Fine-pitch 78um

彰化县| 辉南县| 黄大仙区| 重庆市| 什邡市| 津市市| 武山县| 安福县| 会昌县| 铜梁县| 平罗县| 诸暨市| 东乌珠穆沁旗| 邵阳市| 南川市| 建德市| 抚宁县| 贞丰县| 合川市| 浙江省| 五常市| 甘肃省| 彰化县| 民和| 新平| 易门县| 华阴市| 温州市| 普洱| 大田县| 富民县| 乌兰浩特市| 瑞安市| 泾川县| 大田县| 翁源县| 阳春市| 通化市| 册亨县| 繁峙县| 竹溪县|